Growing demand for multi-chiplets and advanced IC packaging drives 3D IC market growth to USD 34.9 billion by 2030.
The 3D Integrated Circuit (3D IC) market is expected to acquire a valuation of approximately USD 34.9 billion by the end of 2030, according to a comprehensive research report by Market Research Future (MRFR). The market is anticipated to flourish at a robust CAGR of over 20.1% during the assessment timeframe. Growing demand for multi-chiplets and advanced IC packaging drives the 3D IC market. The advancements in 3D integrated circuits are the main driving force that the consumer electronics sector has raised to an unprecedented level today.
The proliferation of IoT technology propels market growth, adding billions of new units to the Internet. Furthermore, new units, including data storage devices, sensors, computers, and related infrastructure, explain the augmented demand these electronic components perceive, with their ability to interact with each other and integrate into software systems and networks. Key players in the 3D integrated circuit market include Tezzaron Semiconductor Corporation, Xilinx Inc., BeSang Inc., United Microelectronics Corporation, Monolithic 3D Inc., 3M Company, IBM Corporation, and Intel Corporation.
The Asia Pacific region dominates the global 3D integrated circuit market. The growing demand for consumer electronics and the use of smart devices drive the 3D ICs market growth. Besides, the rising awareness of the advantages of 3D ICs and technological developments boost the 3D integrated circuit market size. Rapidly developing countries such as China, India, South Korea, and Malaysia, augmented market penetration of smartphones and the demand for energy-efficient devices positively impact market growth.
North America is emerging as the fastest-growing market for 3D integrated circuits. The huge demand for security systems and business intelligence substantiates market revenues. Additionally, the easy availability of raw materials, alongside the developed infrastructure and growing demand for 3D integrated circuits, accelerate the 3D integrated circuit market share. Canada and the US are the leading markets for 3D integrated circuits in North America.
The global 3D integrated circuit market appears highly competitive, characterized by the presence of several notable players. Matured companies incorporate acquisition, partnership, collaboration, technology launch, and expansion to maintain their market position. Managing the cost of raw materials remains a top priority for manufacturers continuing to be concerned about coping with these pricing fluctuations, and many firms are seeking new ways to mitigate risks associated with raw materials instability. The emergence of smart automobiles, industrial machinery, and infrastructure creates significant opportunities for the 3D IC market. Additional factors defining the growing integrated circuit market landscape include the wide adoption of smartphones and other wearable devices worldwide.
The 3D Integrated Circuit (3D IC) market is expected to acquire a valuation of approximately USD 34.9 billion by the end of 2030. The market is anticipated to flourish at a robust CAGR of over 20.1% during the assessment timeframe, driven by growing demand for multi-chiplets and advanced IC packaging. The Asia Pacific region dominates the global 3D integrated circuit market, driven by the growing demand for consumer electronics and the use of smart devices. North America is emerging as the fastest-growing market for 3D integrated circuits, driven by the huge demand for security systems and business intelligence.
The key players in the 3D integrated circuit market include Tezzaron Semiconductor Corporation, Xilinx Inc., BeSang Inc., United Microelectronics Corporation, Monolithic 3D Inc., 3M Company, IBM Corporation, and Intel Corporation. The global 3D integrated circuit market appears highly competitive, characterized by the presence of several notable players. Matured companies incorporate acquisition, partnership, collaboration, technology launch, and expansion to maintain their market position.
The emergence of smart automobiles, industrial machinery, and infrastructure creates significant opportunities for the 3D IC market. Additional factors defining the growing integrated circuit market landscape include the wide adoption of smartphones and other wearable devices worldwide. The proliferation of IoT technology propels market growth, adding billions of new units to the Internet. Furthermore, new units, including data storage devices, sensors, computers, and related infrastructure, explain the augmented demand these electronic components perceive, with their ability to interact with each other and integrate into software systems and networks.
Overall, the 3D Integrated Circuit (3D IC) market is expected to acquire a valuation of approximately USD 34.9 billion by the end of 2030, driven by growing demand for multi-chiplets and advanced IC packaging, the emergence of smart automobiles, industrial machinery, and infrastructure, the proliferation of IoT technology, and the wide adoption of smartphones and other wearable devices worldwide.
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